(China (Mainland))
Product Summary
The MC-222254AF9-B85X-BT3 is a stacked type MCP (Multi-Chip Package) of 33,554,432 bits (BYTE mode: 4,194,304 words by 8 bits, WORD mod : 2,097,152 words by 16 bits) flash memory and 4,194,304 bits (BYTE mode: 524,288 words by 8 bits, WORD mode : 262,144 words by 16 bits) static RAM. The MC-222254AF9-B85X-BT3 is packaged in a 77-pin TAPE FBGA.
Parametrics
MC-222254AF9-B85X-BT3 absolute maximum ratings: (1)Supply voltage, VCCf, VCCs: –0.5 to +4.0 V; (2)Input / Output voltage VT: –0.5 to +13.0 V; (3)Ambient operation temperature, TA: –25 to +85℃; (4)Storage temperature, Tstg: –55 to +125℃.
Features
MC-222254AF9-B85X-BT3 features: (1)Fast access time : tACC = 85 ns (MAX.) (Flash Memory), tAA = 70 ns (MAX.) (SRAM); (2)Supply voltage : VCCf / VCCs = 2.7 to 3.6 V; (3)Wide operating temperature : TA = -25 to +85℃.
Diagrams
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MC-21 |
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TERM BARRIER 21CIRC DUAL ROW |
Data Sheet |
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